微機(jī)電系統(tǒng)基礎(chǔ)（英文版）

PREFACE
　　A NOTE TO INSTRUCTORS
　　ABOUT THE AUTHOR
　　NOTATIONAL CONVENTIONS
　　Chapter 1 Introduction
　　1.0 Preview
　　1.1 The History of MEMS Development
　　1.2 The Intrinsic Characteristics of MEMS
　　1.2.1 Miniaturization
　　1.2.2 Microelectronics Integration
　　1.2.3 Mass Fabrication with Precision
　　
　　1.3 Devices: Sensors and Actuators
　　1.3.1 Energy Domains and Transducers
　　1.3.2 Sensors
　　1.3.3 Actuators
　　Summary
　　Problems
　　References
　　
　　Chapter 2 Introduction to Microfabrication
　　2.0 Preview
　　2.1 Overview of Microfabrication
　　2.2 The Microelectronics Fabrication Process
　　2.3 Silicon-Based MEMS Processes
　　2.4 New Materials and Fabrication Processes
　　2.5 Points of Consideration for Processing
　　Summary
　　Problems
　　References
　　
　　Chapter 3 Review of Essential Electrical and Mechanical Concepts
　　3.0 Preview
　　3.1 Conductivity of Semiconductors
　　3.1.1 Semiconductor Materials
　　3.1.2　Calculation of Charge Carrier Concentration
　　3.1.3 Conductivity and Resistivity
　　
　　3.2 Crystal Planes and Orientation
　　3.3 Stress and Strain
　　3.3.1 Internal Force Analysis: Newton's Laws of Motion
　　3.3.2　Definitions of Stress and Strain
　　3.3.3 General Scalar Relation Between Tensile Stress and Strain
　　3.3.4 Mechanical Properties of Silicon and Related Thin Films
　　3.3.5　General Stress-Strain Relations
　　
　　3.4 Flexural Beam Bending Analysis Under Simple Loading Conditions
　　3.4.1 Types of Beams
　　3.4.2 Longitudinal Strain Under Pure Bending
　　3.4.3　Deflection of Beams
　　3.4.4　Finding the Spring Constants
　　
　　3.5 Torsional Deflections
　　3.6 Intrinsic Stress
　　3.7 Resonant Frequency and Quality Factor
　　3.8 Active Tuning of the Spring Constant and Resonant Frequency
　　3.9 A List of Suggested Courses and Books
　　Summary
　　Problems
　　References
　　
　　Chapter 4 Electrostatic Sensing and Actuation
　　4.0 Preview 103
　　4.1 Introduction to Electrostatic Sensors and Actuators
　　4.2 Parallel-Plate Capacitors
　　4.2.1 Capacitance of Parallel Plates
　　4.2.2 Equilibrium Position of Electrostatic Actuator Under Bias
　　4.2.3 Pull-In Effect of Parallel-Plate Actuators
　　
　　4.3 Applications of Parallel-Plate Capacitors
　　4.3.1 Inertia Sensor
　　4.3.2 Pressure Sensor
　　4.3.3 Flow Sensor
　　4.3.4 Tactile Sensor
　　4.3.5 Parallel-Plate Actuators
　　
　　4.4 Interdigitated Finger Capacitors
　　4.5 Applications of Comb-Drive Devices
　　4.5.1 Inertia Sensors
　　4.5.2 Actuators
　　Summary
　　Problems
　　References
　　Chapter 5 Thermal Sensing and Actuation
　　Chapter 6 Piezoresistive Sensors
　　Chapter 7 Piexoelectric Sensing and Actuation
　　Chapter 8 Magnetic Actuation
　　Chapter 9 Summary of Sensing and Actuation
　　Chapter 10 Bulk Micromachining and Silicon Anisotropic Etching
　　Chapter 11 Surface Micromachining
　　Chapter 12 Polymer MEMS
　　Chapter 13 Microfluidics Applications
　　Chapter 14 Instruments for Scanning Probe Microscopy
　　Chapter 15 Optical MEMS
　　Chapter 16 MEMS Technology Management
　　Appendix A Material Properties
　　Appendix B　Frequently Used Formulas for Beams and Membranes
　　Index