半導(dǎo)體器件原理與技術(shù)

　　This book comprehensively and deeply introduces the semiconductor device principle and technology. The book consists of three sections： semiconductor physics and devices， semiconductor manufacturing process and semiconductor packaging，testing and simulating. The first section mainly introduces semiconductor physics foundation， diode， bipolar junction transistor， MOS field effect transistor， power MOSFET， thyristor， IGBT， passive device and SPICE model. The second section mainly introduces semiconductor process technology， semiconductor process simulation and film preparation technology. The third section mainly introduces semiconductor packaging， testing and simulating technology. These contents will lay a solid foundation for further mastering the basic theories and methods of analysis， design， manufacturing， packaging and testing of semiconductor devices.This book can be used as a textbook for undergraduate and graduate students who are engaged in the analysis， design， manufacturing， packaging and testing of semiconductor devices and IC design. It can also be used as a selfstudy and reference book for professional engineers.

暫缺《半導(dǎo)體器件原理與技術(shù)》作者簡介